CA2051535A1 - Signature panel and process for producing the same - Google Patents
Signature panel and process for producing the sameInfo
- Publication number
- CA2051535A1 CA2051535A1 CA002051535A CA2051535A CA2051535A1 CA 2051535 A1 CA2051535 A1 CA 2051535A1 CA 002051535 A CA002051535 A CA 002051535A CA 2051535 A CA2051535 A CA 2051535A CA 2051535 A1 CA2051535 A1 CA 2051535A1
- Authority
- CA
- Canada
- Prior art keywords
- signature
- panel
- thermoplastic resin
- signature panel
- graphic pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/318—Signatures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
- B42D25/455—Associating two or more layers using heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/913—Material designed to be responsive to temperature, light, moisture
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/914—Transfer or decalcomania
- Y10S428/915—Fraud or tamper detecting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/916—Fraud or tamper detecting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24851—Intermediate layer is discontinuous or differential
- Y10T428/24868—Translucent outer layer
- Y10T428/24876—Intermediate layer contains particulate material [e.g., pigment, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
- Y10T428/24901—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material including coloring matter
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24934—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including paper layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
Abstract
ABSTRACT
The improved process for producing a signature panel comprises the steps of forming on the writing surface of a panel substrate a printed graphic pattern that will change upon exposure to alcohols, organic solvents, bleaching agents and surfactants, and laminating the other surface of the panel substrate with a thermoplastic resin by extrusion, or hot melt coating. According to this process, signature panels can be thermocompressed at comparatively Low temperatures not only to roll mills of overprint cards using a polyvinyl chloride sheet as an oversheet base but also to card substrates such as PET sheets, metal sheets and glass sheets without causing any adverse effects on the graphic pattern printed on the writing surface of the panel which will change upon exposure to chemicals.
The improved process for producing a signature panel comprises the steps of forming on the writing surface of a panel substrate a printed graphic pattern that will change upon exposure to alcohols, organic solvents, bleaching agents and surfactants, and laminating the other surface of the panel substrate with a thermoplastic resin by extrusion, or hot melt coating. According to this process, signature panels can be thermocompressed at comparatively Low temperatures not only to roll mills of overprint cards using a polyvinyl chloride sheet as an oversheet base but also to card substrates such as PET sheets, metal sheets and glass sheets without causing any adverse effects on the graphic pattern printed on the writing surface of the panel which will change upon exposure to chemicals.
Description
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~06 7 SIGNAT[~RE PANEL AND PROCESS FO~
PRODt~CING THE SAME
This invention relates -to a signature panel to be formed on the surface of cards, such as debi-t cards, credi-t cards, identification cards and membership cards. The invention also relates -to a process for producing such a signature panel.
Cards, such as those listed above, must be checked for their legitimacy and that of -their holders. A method of meeting this requirement is to have cardholders sign their names in an area specified as a "signature panel".
~ major problem wi-th cards is that a person who is not -the true holder of a card can use it i~ he forges the au-thentic signature of the card holderO
Various methods have been proposed to prevent forgery and tampering with cards. One method is to use a signature panel on the surEace of a synthetic resin board. This panel has formed on the writing surface a graphic pattern -that will change upon exposure to alcohols, soLvents, hleaching agents and surfactants. Several versions of such signature panels have been proposed by American ~anknote Co. Ltd., U.S.A., Maccor~uodale ~o. I.kd., U.S.~., Thomas de larue Co. Ltd., ~.S.A., ~arrison & Sons, Ltd. ~.K., e-tc.
The writing surfaces of -the signature panels proposed by those companies are provided with graphic patterns -that will change upon exposure to alcohols, solvents ~e~g~
methyl e-thyl ketone, toluene, gasoline and thinners), bleaching agents or sur~actants (e.g. detergents) (which 3Q are hereunder collectively referred to as "chemicals"). If someone wants to tamper with the signature inscribed on such panels, he has to erase it and then write a false signature. However, if the au-thentic signature is erased with chemicals, the graphic pa-ttern provided in -the signature panel will undergo some change such as 2 ~
dissolu-tion, swelling, Eading or change of colour. This makes the ac-t of tampering clearly eviden-t.
The signa-ture panels described above have to be bonded to the c~rd substrate. If the card substrate is made of polyvinyl chloride without any surface ~reatment, there is no need to use solvent-con-taining adhesives. The signature ~anels can be bonded to the card subs-trate merely by thermocompression conducted at a fairly high temperature of about 150C. ~owever, if the card substrate has a polyvinyl chloride oversheet coated on the entire surface, and a colored graphic pattern (a card using this substrate is often referred -to as an "overprint card"), the graphic pat-tern will deform thermally at elevated temperatures of 150C. The signature panel cannot therefore be bonded to the subs-trate wi-thout using an adhesive.
Conventional signature panels cannot be thermocompressed onto card substrates, such as polyethylene terephthalate ~PET) sheets, metal sheets and glass sheets.
An adhesive must be used to bond -them together.
~owever, if an adhesive is used to bond the signature panels to certain card substrates, -the solvents contained in the adhesive will cause a change in the printed graphic pattern on the writin~J surface of the panels, which will change upon exposure to chemicals. This has made it practically impossible to use adhesives for the purpose of bonding signature panels and card substrates.
The present invention seeks to provide a signature panel that can be thermocompressed at comparatively low temperatures not only to roll mills of overprint cards using a polyvinyl chloride sheet as an oversheet base but also to card substrates ~uch as PET sheets, metal sheets and glass sheets without causin~ any adverse effects on the graphic pattern printed on the writing surface of the panel ~` which will change upon exposure to chemicals. The present , .
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nvention also seeks to provide a process for producing such an improved sicJnatUre panel.
In a firs-t aspect, the present invention provides a signature panel that has a thermoplastic resin layer provided on the side of a panel substra-te which is opposi-te the writing surface carrying a printed graphic pattern that wil:L change upon exposure -to alcohols, organic solvents, bleaching agents and surfactants.
In a ~urther aspect, the invention is a process for producing a signature panel that comprises the steps of forming on the wri-ting surface of a panel substrate a printed graphic pattern that wil.l change upon exposure to alcohols, organic solvents, bleaching agents an~
surfactants r and laminating the othe.r sur~ace of the substra-te with thermoplastic resin by extrusion or hot melt coating.
In a further aspect, the invention is a process for producing a signa-ture panel that comprises the steps of forming on the writing surface of a panel sub~trate a printed graphic pattern that will change upon exposure to alcohols, organic solvents, bleaching agents and surfactan-ts, roll coating release paper with a thermoplastic resin dissolved in an organic solvent, removing the solvent by drying, and laminating the other ~5 surface of the panel substrate with the thermoplastic resin layer by thermal fusion.
The signature panel of the present invention has a thermoplastic resin layer provided on the back by extrusion or hot melt coating without using any chemicals such as 3~ organic solvents. ~ence, no change will occur in the printed graphic pattern upon exposure to chemicals. The thermoplastic resin layer coated on the back of the substrate of the signature panel exhibits an effective .
, thermal bonding property with respect to both panel :
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substra-tes and card substrates even if thermocompression is performed at temperatures of up to 150C. Therefore, the signature panel of -the present inven-tion can be bonded to "overprint cards" without causing -thermal deformation of the graphic pat-tern formed on -their surface.
According to the first process aspect of the presen-t inven-tion, a thermoplastic resin :Layer can be applied in a desired thickness to the back of a panel substrate withou-t using organic solvents or other chemicals as coatiny aids.
According to the se~ond process aspect, a signa-ture panel, organic solvents and other chemicals may be used as coating aids and yet a thermoplastic resin layer can be applied in a desired thickness to the back of a panel substrate wlthout permit-ting the chemicals to make direct contact with the substrate.
The invention is illustrated in the drawings, in which:
Fig. 1 is a plan view of a card having the signature panel of the present invention provided thereon;
Fig. 2 is an enlarged cross section of the signature panel of the present invention;
Fig. 3 is an enlarged cross section of a signature panel formed by co-extrusion coating;
Fig. 4 is a diagram showing how a thermoplastic resin is coated by extrusion;
Fig. 5 is a diagram showing how a thermoplastic resin is coated by co-ex-trusion; and Fig. 6 shows diagrammatically a thermocompression appara-tus used to bond the signature panel of the present invention to a card substrate.
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The preferred embodiments of the present invention are described below with reference to Figs. 2 - 6. Figure 1 shows a card 10 having a signature panel 12.
Fi~. 2 is an enlarged cross section of the signa-ture panel of the present invention. As shown, a printed graphic pa~tern 14 that will change upon exposure to chemicals is formed on top of a panel substrate ~6. A
thermoplas-tic resin layer 18 is formed on the underside of the substrate 16.
The substrate 16 is made of a material that is highly permeable to alcohols~ organic solvents, bleaching agents and surfac-tants. The substrate is typically made of a paper base that will easily absorb and fix the ink of a fountain pen, a ball-point pen or a felt pen which are used to inscribe signatures, -that will adhere s~rongly to card substrates, and that helps the signature panel become forgery-and tamper-proof.
The printed graphic pattern 14 which will change upon exposure to chemicals may be formed of inks that use oil dyes (solvent dyes) which are highly soluble in solvents, inks -that use dyes vulnerable to oxidation bleaching or reduction bleaching, or inks that use binders subject to the attack of solvents. These are not the only printed graphic patterns that are acceptable and any other printed patterns may be used as long as they will readily change upon exposure to the chemicals mentioned above. Useful panel substrates are commercially available from American Banknote Co. Ltd., U.S.A., Maccorquodale Co. Ltd., U.S.A., Thomas de larue Co. Ltd., U.S.A., and ~arrison & Sons.
Ltd., U.K. but details of those proprietary products have not been published.
The layer 18 is made of a thermoplastic resin that can be applied by extrusion coating or hot melt coating and which, upon thermocompression at temperatures of up to 150C, will insure strong adhesion between the paper base of signature panel and card substrates typified by polyvinyl chloride.
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The signature panel of the present invention is formed by bon~ing the paper base having -the characteristics described above onto the card substra-te wi-thout using an adhesive. The present inven-tor conducted various s-tudies in order to find -thermoplastic resins that would meet the bonding conditions described above and found that the followin~ resins had satis~ac-tory bonding properties-urethane resins, vinyl chloride polymers, and mixtures or copolymers thereof; ethylene/vinyl acetate copolymers, ethylene/acrylic acid copolymers, ethylene/acrylic acid ester copolymers, mixtures thereof with a -tackifier, and mixtures thereof with a tackifier and a wax; co-polyester resins and co-polyamide resins; and polye-thylene or ethylene/vinyl acetate copolymers that have maleic anhydride or other unsaturated carboxylic acids grafted thereto. Among those resins, urethane resins, vinyl chloride polymers and mixtures or copolymers ~hereof proved to be satisfactory in terms of the strength of bond to be sa-tisfactory in terms of the strength of bond to signature panels and endurance.
The term "urethane resins" as used herein means those ~ linear, random, alternating block copolymers which contain -~ as major components an QH--terminated long-chain polyol diisocyanate having a molecular weight of 1,000 to 3,000 and a chain extender such as a short-chain polyol having a molecular weight of up to 500. Thus, depending on the type of long-chain polyol used, urethane resins may be polyes-ter-, polyether- or polycaprolactone-based, all o which can be used in the present invention. Particularly preferred are thermoplastic urethane resins in which the chemical equivalent ratio of an isocyanate group to a hydroxy group is less than unity. Such thermoplastic urethane resins permit the temperature for thermocompression to be lowered to 100 - 110C so that the possible deterioration of card substrates by thermocompression is prevented and processlng speed increased.
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Usable vinyl chloride polymers include polyvinyl chloride, a vinyl chloride/vinyl acetate copolymer and a vinyl chloricle/vinylidene chloride copolymer. Mixtures of urethane and vinyl chloride polymers as well as copolymers thereof also exhibi-t good bonding proper-ties. Particularly preferred are those vinyl chloride polymers which contain 20 - 80 wt% of vinyl chloride.
Layers of these thermoplastic resins can be ormed on the paper base of the signature panel by extrusion coating.
1~ However, urethane resins, vinyl chloride polymers, mixtures of urethane and vinyl chloride polymers and copolymers thereof are difficult to form effectively as single layers in thicknesses not greater -than 30 ~m. E'urther, the signature panel of the present invention typically has the thermoplastic resin layer in a thickness of 2 - 50 ~m, preferably 5 - 30 ~m. If the thermoplastlc resin layer is thinner -than 2 ~m, no adequate strength of adhesion will be a-ttained. The strength of adhesion will not be increased even if the thickness of the adhesive layer e*ceeds 50 ~m.
On the contrary, excess thermoplastic resin will spread beyond the edges of the signature panel during thermocompression and will stick to the hot plates or the card substrate, potentially causing problems in the use of the cards.
In these circumstances, it is preferred to perform co-extrusion coa$ing as shown in Fig. 5, in which the thermoplastic resin layer 18 is extruded simultaneously with a release layer 20 that is made of an easily extrudable polyolefin resin such as polyethylene or polypropylene. By adopting this technique, consistent ~ coatiny operations can be performed while con-trolling the ; thickness of the thermoplastic resin layer wit'hin the range of 2 - 50 ~m. The signature panel produced by this method is indicated by 12 in Fig. 3. The co-extrusion coating process comprises extruding the thermoplas-tic resin layer 18 on the release layer 20~so t'hat -the two layers will be :`, .. . . .... .
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superposed on a panel suhstrate 16 supplied in a web form, shaping the coatings -to a predetermined thickness by means of rollers 33 and 34, and winding up -the assembly by a -take up roller 36.
After the co-extrusion coatin~, the polyolefin release layer 20 is stripped from the substra-te 16 to yield a signature panel 12 which, as shown in Fig. 2, is an assembly of the paper base and the adhesive thermoplastic resin layer.
Still other examples of useful thermoplastic resins are e-thyLene/viny:l acetate copolymers, ethylene/acrylic acid copolymers, ethylene/acrylic acid ester copolymers, mixtures thereof with a tackifier, and mix-tures thereof with a tackifier and a wax. These thermoplastic resins are satisfactory in terms of the strength of adhesion to signature panels durir.g thermocompression, endurance of signature panels and the ease of thin film formation.
The preferred ethylene/vinyl acetate copolymer has a ~inyl aceta-te content of 3 - 30 wt%, with the range of 10 -20 mol% being more preferred. Illustrativeethylene/acrylic acid copolymers include an ethylene/acrylic acid copolymer and an ethylene/methacrylic i acid copolymer, and illustrative ethylene/acrylic acid ester copolymers include an ethylene/ethyl acrylate copolymer and an ethylene/methyl acrylate copolymer.
Exemplary tackifiers that can be used include terpene resins, rosins, modified rosins, aliphatic petroleum resins, aromatic petroleum resins and coumarone-indene resins. These tackifiers are preferably added in~amounts of 1 - 20 wt%. Waxes that can~be used include paraffin wax, microcrystalline wax, carnauba wax and polyethylene wax and they are preferably added in amounts of 5 - 30 wt~o.
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-The thermoplastic resins described above may be applied by extrusion coating as shown in Fig. 4. 1'he thermoplastic resin layer 18 is extruded through a nozzle and superposed on a web of a panel substra-te 16 suppliecl in a web form. The coating is -then shaped to a predetermined thickness by means of rollers 33 and 34, and the assembly is guided by a roller 35 to be wound up by a take up roller 36, whereby the signa-ture panel of the present invention is produced. Mixtures of ethylene/vinyl acetate copolymers with a tackifier and a wax may also be applied by hot mel-t coating. They are melted by heating to 60 - 1~0C then roll coa-ted.
The second method of the present invention for producing -the signature panel described above comprises dissolving the thermoplastic resin in an organic solvent serving as a coating aid, applying the solution onto silicone release paper in a predetermined thickness by roll coating, drying the applied coating adequa-tely, superposing it on a panel substrate, bonding them together by heated rollers, and stripping the silicone release paper to obtain the intended signature panel of the present invention.
This me-thod has the advantage that organic solvents can be used as coa~ing aids without causing any adverse effects on the printed graphic pattern formed on the signature panel.
The signature panel 12 produced by the above~described processes is slit to a suitable size and bonded to a predetermined area of a ~ard by means of a thermocompression apparatus of the type shown in Fig. 6.
This apparatus consists of two hot plates 30 and 32 at least one of which is movable. A card 10 and the signature panel 12, placed in a predetermined position ~n the card 10, are held between the hot plates 30 and 32, followed by thermocompression to bond the signature panel 12 to the card 10.
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-- 1() --The following examples illustrate the present invention; -they are no-t intended -to limit i-t.
Example 1 .
An ink for printing a graphic pattern on signature panels was prepared according to the followin~ formula:
Sumiplast Blue OA (blue oil dye of SUMITOMO CHEMICAL CO., LTD. ) 10 parts Ethyl cellulose (Ethocell N-7 of ~ercules Incorporated) 7 parts Isopropyl alcohol 33 parts Ethanol 50 parts Using this ink, a graphic pattern was printed on one side of a signature panel subs-trate made of wood-free paper (product of Oji Paper Co., L-td.; 788 x 1091 om; 45 kg).
; 15 Onto the other side of the substrate, a urethane resin and polypropylene were applied by co-extrusion. The urethane resin was a polyester-based polyurethane in which the chemical equivalent ratio o an isocyanate group to a hydroxyl group was 0.99. The urethane resin coat had a thickness of 10 ~m~
Subsequently, the polypropylene layer was stripped and the assembly of the urethane resin coat and the substrate was slit to tapes in a width of 10 mm, whereby signatureS
panels were produced.
Those signature panels were bonded onto cards by thermocompression at 110C. The prepared cards were free from any deterioration and discoloration of the ink of which the printed graphic pattern was formed on the signature panels. In addition, the signature panels adhered so strongly to the cards that they could not be ; stripped without causing picking of the paper base. It was therefore clear that those signature panels had *Trade-mark 3 ~
, satisfactory securi-ty a~ainst forgery and tampering.
To verify its effec-tiveness, the present inven-tion as described in Example 1 was compared with a prior art method of bonding signature panels to cards.
_mParative_Exam~_e_ As in Example l, an ink for printing a graphic pattern on signature panels was formulated and a predetermined graphic pattern was printed on one side of wood-free paper.
Subsequently, an adhesive was prepared according to 10 the following formula:
Vinyl chloride acetate resin 15 parts Acrylic resin 10 parts Methyl ethy:L ketone 38 parts Toluene 37 parts The adhesive was then coated onto the other side of the signature panel substrate. The ink dissolved into the solvents in the adhesive and the graphic pat-tern deformed and discolored.
Example 2 A signature panel ~with a printed graphic pattern) available from American Banknote Co., Ltd. was wsed as a substrate~ A mixture in which an ethylene/vinyl acetate copolymer ~15 mol% vinyl acetate) and rosin a~ a tackifier were incorporated in a ratio of 85:15 was extrusion coated in a -thickness of 20 ~m on the back of -the substrate. The so treated panel substrate was bonded -to a ca.rd by thermocompression at 120C. The card was free from any deterioration. There was no discolora-tion of the ink of which the printed graphic pattern was formed on the signature panel. In addition, the signature pane~ adhered to the card with sufficient strength.
To verify its effectiveness, the method of F.xample 2 ~. ' .' ~- :
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- ~2 -was compared with a prior art method of bonding signature pane:Ls to cards.
Comparative Exam~le 2 _____ An adhesive was prepared accordin~ to the following 5 formula:
Vinyl chloride acetate resin 15 par-ts Acrylic resin 10 parts Methyl ethyl ketone 38 partæ
Toluene 37 parts The adhesive was coated onto a signature panel of American Banlcno-te Co., Ltd. as in Example 2. The ink used to print the graphic pattern on the signa-ture panel dissolved into the solvents in the adhesive and discoloration of the graphic pattern occurred.
5 Example 3 An adipate ester based linear polyurethane resin ~Paraprene P22S of Nippon Miractron Co., Ltd.) was dissolved in a solvent system of dimethylformamide and methyl ethyl ketone to give a solids content of 15%, whereby a polyurethane coating solu-tion was prepared. This solution was roll coated in a thickness of 5 ~m onto silicone release paper and the solvents were evaporated by drying. In a separate step, an ink was formulated as in Example 1 and a graphic pattern was printed on a signature panel substrate that was made of wood-~ree paper. The silicone release paper was then bonded to the signature panel substrate by means of heated rolls at 110Co Subsequently, -the silicone release paper was stripped and the assembly of the substrate and the polyurethane coa-t was slit to tapes in a width of 10 mm, whereby signature panels were produced.
Those signature panels were bonded onto cards by thermocompression at 110C. The thus prepared cards were *Trade-mark 2 ~ 3 ~
free from any deterioration. Discoloration of -the ink oE
which the printed ~raphic pattern was forme~ on the signature panels did not occur. ln addition, -the signature panels adhered so strongly to the cards tha-t they could no-t be stripped without picking of the paper base. lt was therefore clear that those signature panels had satisfactory securi-ty against forgery and ta~pering.
As described on the foregoing pages, the signature panel of the present inven-tion has a thermoplastic resin layer formed on the back side which is opposite the writing surface carrying a printed graphic pattern that is highly permeahle to alcohols, organic solvents, bleaahing agents and surfac~ants and that ~ill change upon exposure to those chemicals. ~ecause of this structure, the signature panel has high security against the forgery and tampering. This signature panel can be bonded to card substrates without using adhesives containing solvents and, hence, withou-t causing any change in the printed graphic pat~ern on the panel. Furthermore, oversheet substrates which have graphic patterns formed in correspondence to overprint cards can be used with the signature panel of the present invention without experiencing any thermal deforma-tion~ In addition, the thermoplastic resins that are used in the present invention will exhibi-t very good bonding properties when they are thermocompressed onto vinyl chloride resin sheets, PET sheets, metal sheets, glass sheets and other card substrates.
According to the process of the present invention for producing the above-described signature panel, the thermoplastic resin can be coa-ted onto the back of a signature panel substrate in such a way that the panel can be bonded to card substrates without reducing the strength of adhesion. As a further advantage, the ther~oplastic resin can be applied to form such a thin layer that it will not spread beyond the edges of the panel, -thereby . . ~ . .
. . .
.
2 ~ 3 5 - 14 ~
permitting -the panel to be nea-tly positioned on the card substrate.
:Lf necessary the -thermoplastic resin may be applied using organic solvents and o-ther coating aids and yet -the prin-ted graphic pa-t-tern on the signature panel will no-t be affected adversely.
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~06 7 SIGNAT[~RE PANEL AND PROCESS FO~
PRODt~CING THE SAME
This invention relates -to a signature panel to be formed on the surface of cards, such as debi-t cards, credi-t cards, identification cards and membership cards. The invention also relates -to a process for producing such a signature panel.
Cards, such as those listed above, must be checked for their legitimacy and that of -their holders. A method of meeting this requirement is to have cardholders sign their names in an area specified as a "signature panel".
~ major problem wi-th cards is that a person who is not -the true holder of a card can use it i~ he forges the au-thentic signature of the card holderO
Various methods have been proposed to prevent forgery and tampering with cards. One method is to use a signature panel on the surEace of a synthetic resin board. This panel has formed on the writing surface a graphic pattern -that will change upon exposure to alcohols, soLvents, hleaching agents and surfactants. Several versions of such signature panels have been proposed by American ~anknote Co. Ltd., U.S.A., Maccor~uodale ~o. I.kd., U.S.~., Thomas de larue Co. Ltd., ~.S.A., ~arrison & Sons, Ltd. ~.K., e-tc.
The writing surfaces of -the signature panels proposed by those companies are provided with graphic patterns -that will change upon exposure to alcohols, solvents ~e~g~
methyl e-thyl ketone, toluene, gasoline and thinners), bleaching agents or sur~actants (e.g. detergents) (which 3Q are hereunder collectively referred to as "chemicals"). If someone wants to tamper with the signature inscribed on such panels, he has to erase it and then write a false signature. However, if the au-thentic signature is erased with chemicals, the graphic pa-ttern provided in -the signature panel will undergo some change such as 2 ~
dissolu-tion, swelling, Eading or change of colour. This makes the ac-t of tampering clearly eviden-t.
The signa-ture panels described above have to be bonded to the c~rd substrate. If the card substrate is made of polyvinyl chloride without any surface ~reatment, there is no need to use solvent-con-taining adhesives. The signature ~anels can be bonded to the card subs-trate merely by thermocompression conducted at a fairly high temperature of about 150C. ~owever, if the card substrate has a polyvinyl chloride oversheet coated on the entire surface, and a colored graphic pattern (a card using this substrate is often referred -to as an "overprint card"), the graphic pat-tern will deform thermally at elevated temperatures of 150C. The signature panel cannot therefore be bonded to the subs-trate wi-thout using an adhesive.
Conventional signature panels cannot be thermocompressed onto card substrates, such as polyethylene terephthalate ~PET) sheets, metal sheets and glass sheets.
An adhesive must be used to bond -them together.
~owever, if an adhesive is used to bond the signature panels to certain card substrates, -the solvents contained in the adhesive will cause a change in the printed graphic pattern on the writin~J surface of the panels, which will change upon exposure to chemicals. This has made it practically impossible to use adhesives for the purpose of bonding signature panels and card substrates.
The present invention seeks to provide a signature panel that can be thermocompressed at comparatively low temperatures not only to roll mills of overprint cards using a polyvinyl chloride sheet as an oversheet base but also to card substrates ~uch as PET sheets, metal sheets and glass sheets without causin~ any adverse effects on the graphic pattern printed on the writing surface of the panel ~` which will change upon exposure to chemicals. The present , .
_ 3 _ 2~
nvention also seeks to provide a process for producing such an improved sicJnatUre panel.
In a firs-t aspect, the present invention provides a signature panel that has a thermoplastic resin layer provided on the side of a panel substra-te which is opposi-te the writing surface carrying a printed graphic pattern that wil:L change upon exposure -to alcohols, organic solvents, bleaching agents and surfactants.
In a ~urther aspect, the invention is a process for producing a signature panel that comprises the steps of forming on the wri-ting surface of a panel substrate a printed graphic pattern that wil.l change upon exposure to alcohols, organic solvents, bleaching agents an~
surfactants r and laminating the othe.r sur~ace of the substra-te with thermoplastic resin by extrusion or hot melt coating.
In a further aspect, the invention is a process for producing a signa-ture panel that comprises the steps of forming on the writing surface of a panel sub~trate a printed graphic pattern that will change upon exposure to alcohols, organic solvents, bleaching agents and surfactan-ts, roll coating release paper with a thermoplastic resin dissolved in an organic solvent, removing the solvent by drying, and laminating the other ~5 surface of the panel substrate with the thermoplastic resin layer by thermal fusion.
The signature panel of the present invention has a thermoplastic resin layer provided on the back by extrusion or hot melt coating without using any chemicals such as 3~ organic solvents. ~ence, no change will occur in the printed graphic pattern upon exposure to chemicals. The thermoplastic resin layer coated on the back of the substrate of the signature panel exhibits an effective .
, thermal bonding property with respect to both panel :
2 ~
substra-tes and card substrates even if thermocompression is performed at temperatures of up to 150C. Therefore, the signature panel of -the present inven-tion can be bonded to "overprint cards" without causing -thermal deformation of the graphic pat-tern formed on -their surface.
According to the first process aspect of the presen-t inven-tion, a thermoplastic resin :Layer can be applied in a desired thickness to the back of a panel substrate withou-t using organic solvents or other chemicals as coatiny aids.
According to the se~ond process aspect, a signa-ture panel, organic solvents and other chemicals may be used as coating aids and yet a thermoplastic resin layer can be applied in a desired thickness to the back of a panel substrate wlthout permit-ting the chemicals to make direct contact with the substrate.
The invention is illustrated in the drawings, in which:
Fig. 1 is a plan view of a card having the signature panel of the present invention provided thereon;
Fig. 2 is an enlarged cross section of the signature panel of the present invention;
Fig. 3 is an enlarged cross section of a signature panel formed by co-extrusion coating;
Fig. 4 is a diagram showing how a thermoplastic resin is coated by extrusion;
Fig. 5 is a diagram showing how a thermoplastic resin is coated by co-ex-trusion; and Fig. 6 shows diagrammatically a thermocompression appara-tus used to bond the signature panel of the present invention to a card substrate.
;
The preferred embodiments of the present invention are described below with reference to Figs. 2 - 6. Figure 1 shows a card 10 having a signature panel 12.
Fi~. 2 is an enlarged cross section of the signa-ture panel of the present invention. As shown, a printed graphic pa~tern 14 that will change upon exposure to chemicals is formed on top of a panel substrate ~6. A
thermoplas-tic resin layer 18 is formed on the underside of the substrate 16.
The substrate 16 is made of a material that is highly permeable to alcohols~ organic solvents, bleaching agents and surfac-tants. The substrate is typically made of a paper base that will easily absorb and fix the ink of a fountain pen, a ball-point pen or a felt pen which are used to inscribe signatures, -that will adhere s~rongly to card substrates, and that helps the signature panel become forgery-and tamper-proof.
The printed graphic pattern 14 which will change upon exposure to chemicals may be formed of inks that use oil dyes (solvent dyes) which are highly soluble in solvents, inks -that use dyes vulnerable to oxidation bleaching or reduction bleaching, or inks that use binders subject to the attack of solvents. These are not the only printed graphic patterns that are acceptable and any other printed patterns may be used as long as they will readily change upon exposure to the chemicals mentioned above. Useful panel substrates are commercially available from American Banknote Co. Ltd., U.S.A., Maccorquodale Co. Ltd., U.S.A., Thomas de larue Co. Ltd., U.S.A., and ~arrison & Sons.
Ltd., U.K. but details of those proprietary products have not been published.
The layer 18 is made of a thermoplastic resin that can be applied by extrusion coating or hot melt coating and which, upon thermocompression at temperatures of up to 150C, will insure strong adhesion between the paper base of signature panel and card substrates typified by polyvinyl chloride.
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The signature panel of the present invention is formed by bon~ing the paper base having -the characteristics described above onto the card substra-te wi-thout using an adhesive. The present inven-tor conducted various s-tudies in order to find -thermoplastic resins that would meet the bonding conditions described above and found that the followin~ resins had satis~ac-tory bonding properties-urethane resins, vinyl chloride polymers, and mixtures or copolymers thereof; ethylene/vinyl acetate copolymers, ethylene/acrylic acid copolymers, ethylene/acrylic acid ester copolymers, mixtures thereof with a -tackifier, and mixtures thereof with a tackifier and a wax; co-polyester resins and co-polyamide resins; and polye-thylene or ethylene/vinyl acetate copolymers that have maleic anhydride or other unsaturated carboxylic acids grafted thereto. Among those resins, urethane resins, vinyl chloride polymers and mixtures or copolymers ~hereof proved to be satisfactory in terms of the strength of bond to be sa-tisfactory in terms of the strength of bond to signature panels and endurance.
The term "urethane resins" as used herein means those ~ linear, random, alternating block copolymers which contain -~ as major components an QH--terminated long-chain polyol diisocyanate having a molecular weight of 1,000 to 3,000 and a chain extender such as a short-chain polyol having a molecular weight of up to 500. Thus, depending on the type of long-chain polyol used, urethane resins may be polyes-ter-, polyether- or polycaprolactone-based, all o which can be used in the present invention. Particularly preferred are thermoplastic urethane resins in which the chemical equivalent ratio of an isocyanate group to a hydroxy group is less than unity. Such thermoplastic urethane resins permit the temperature for thermocompression to be lowered to 100 - 110C so that the possible deterioration of card substrates by thermocompression is prevented and processlng speed increased.
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Usable vinyl chloride polymers include polyvinyl chloride, a vinyl chloride/vinyl acetate copolymer and a vinyl chloricle/vinylidene chloride copolymer. Mixtures of urethane and vinyl chloride polymers as well as copolymers thereof also exhibi-t good bonding proper-ties. Particularly preferred are those vinyl chloride polymers which contain 20 - 80 wt% of vinyl chloride.
Layers of these thermoplastic resins can be ormed on the paper base of the signature panel by extrusion coating.
1~ However, urethane resins, vinyl chloride polymers, mixtures of urethane and vinyl chloride polymers and copolymers thereof are difficult to form effectively as single layers in thicknesses not greater -than 30 ~m. E'urther, the signature panel of the present invention typically has the thermoplastic resin layer in a thickness of 2 - 50 ~m, preferably 5 - 30 ~m. If the thermoplastlc resin layer is thinner -than 2 ~m, no adequate strength of adhesion will be a-ttained. The strength of adhesion will not be increased even if the thickness of the adhesive layer e*ceeds 50 ~m.
On the contrary, excess thermoplastic resin will spread beyond the edges of the signature panel during thermocompression and will stick to the hot plates or the card substrate, potentially causing problems in the use of the cards.
In these circumstances, it is preferred to perform co-extrusion coa$ing as shown in Fig. 5, in which the thermoplastic resin layer 18 is extruded simultaneously with a release layer 20 that is made of an easily extrudable polyolefin resin such as polyethylene or polypropylene. By adopting this technique, consistent ~ coatiny operations can be performed while con-trolling the ; thickness of the thermoplastic resin layer wit'hin the range of 2 - 50 ~m. The signature panel produced by this method is indicated by 12 in Fig. 3. The co-extrusion coating process comprises extruding the thermoplas-tic resin layer 18 on the release layer 20~so t'hat -the two layers will be :`, .. . . .... .
,, ,; - ~
- ... - . .
.
~: :
2 ~ 3 ~
superposed on a panel suhstrate 16 supplied in a web form, shaping the coatings -to a predetermined thickness by means of rollers 33 and 34, and winding up -the assembly by a -take up roller 36.
After the co-extrusion coatin~, the polyolefin release layer 20 is stripped from the substra-te 16 to yield a signature panel 12 which, as shown in Fig. 2, is an assembly of the paper base and the adhesive thermoplastic resin layer.
Still other examples of useful thermoplastic resins are e-thyLene/viny:l acetate copolymers, ethylene/acrylic acid copolymers, ethylene/acrylic acid ester copolymers, mixtures thereof with a tackifier, and mix-tures thereof with a tackifier and a wax. These thermoplastic resins are satisfactory in terms of the strength of adhesion to signature panels durir.g thermocompression, endurance of signature panels and the ease of thin film formation.
The preferred ethylene/vinyl acetate copolymer has a ~inyl aceta-te content of 3 - 30 wt%, with the range of 10 -20 mol% being more preferred. Illustrativeethylene/acrylic acid copolymers include an ethylene/acrylic acid copolymer and an ethylene/methacrylic i acid copolymer, and illustrative ethylene/acrylic acid ester copolymers include an ethylene/ethyl acrylate copolymer and an ethylene/methyl acrylate copolymer.
Exemplary tackifiers that can be used include terpene resins, rosins, modified rosins, aliphatic petroleum resins, aromatic petroleum resins and coumarone-indene resins. These tackifiers are preferably added in~amounts of 1 - 20 wt%. Waxes that can~be used include paraffin wax, microcrystalline wax, carnauba wax and polyethylene wax and they are preferably added in amounts of 5 - 30 wt~o.
.. ,., ` :
-The thermoplastic resins described above may be applied by extrusion coating as shown in Fig. 4. 1'he thermoplastic resin layer 18 is extruded through a nozzle and superposed on a web of a panel substra-te 16 suppliecl in a web form. The coating is -then shaped to a predetermined thickness by means of rollers 33 and 34, and the assembly is guided by a roller 35 to be wound up by a take up roller 36, whereby the signa-ture panel of the present invention is produced. Mixtures of ethylene/vinyl acetate copolymers with a tackifier and a wax may also be applied by hot mel-t coating. They are melted by heating to 60 - 1~0C then roll coa-ted.
The second method of the present invention for producing -the signature panel described above comprises dissolving the thermoplastic resin in an organic solvent serving as a coating aid, applying the solution onto silicone release paper in a predetermined thickness by roll coating, drying the applied coating adequa-tely, superposing it on a panel substrate, bonding them together by heated rollers, and stripping the silicone release paper to obtain the intended signature panel of the present invention.
This me-thod has the advantage that organic solvents can be used as coa~ing aids without causing any adverse effects on the printed graphic pattern formed on the signature panel.
The signature panel 12 produced by the above~described processes is slit to a suitable size and bonded to a predetermined area of a ~ard by means of a thermocompression apparatus of the type shown in Fig. 6.
This apparatus consists of two hot plates 30 and 32 at least one of which is movable. A card 10 and the signature panel 12, placed in a predetermined position ~n the card 10, are held between the hot plates 30 and 32, followed by thermocompression to bond the signature panel 12 to the card 10.
I
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% ~
-- 1() --The following examples illustrate the present invention; -they are no-t intended -to limit i-t.
Example 1 .
An ink for printing a graphic pattern on signature panels was prepared according to the followin~ formula:
Sumiplast Blue OA (blue oil dye of SUMITOMO CHEMICAL CO., LTD. ) 10 parts Ethyl cellulose (Ethocell N-7 of ~ercules Incorporated) 7 parts Isopropyl alcohol 33 parts Ethanol 50 parts Using this ink, a graphic pattern was printed on one side of a signature panel subs-trate made of wood-free paper (product of Oji Paper Co., L-td.; 788 x 1091 om; 45 kg).
; 15 Onto the other side of the substrate, a urethane resin and polypropylene were applied by co-extrusion. The urethane resin was a polyester-based polyurethane in which the chemical equivalent ratio o an isocyanate group to a hydroxyl group was 0.99. The urethane resin coat had a thickness of 10 ~m~
Subsequently, the polypropylene layer was stripped and the assembly of the urethane resin coat and the substrate was slit to tapes in a width of 10 mm, whereby signatureS
panels were produced.
Those signature panels were bonded onto cards by thermocompression at 110C. The prepared cards were free from any deterioration and discoloration of the ink of which the printed graphic pattern was formed on the signature panels. In addition, the signature panels adhered so strongly to the cards that they could not be ; stripped without causing picking of the paper base. It was therefore clear that those signature panels had *Trade-mark 3 ~
, satisfactory securi-ty a~ainst forgery and tampering.
To verify its effec-tiveness, the present inven-tion as described in Example 1 was compared with a prior art method of bonding signature panels to cards.
_mParative_Exam~_e_ As in Example l, an ink for printing a graphic pattern on signature panels was formulated and a predetermined graphic pattern was printed on one side of wood-free paper.
Subsequently, an adhesive was prepared according to 10 the following formula:
Vinyl chloride acetate resin 15 parts Acrylic resin 10 parts Methyl ethy:L ketone 38 parts Toluene 37 parts The adhesive was then coated onto the other side of the signature panel substrate. The ink dissolved into the solvents in the adhesive and the graphic pat-tern deformed and discolored.
Example 2 A signature panel ~with a printed graphic pattern) available from American Banknote Co., Ltd. was wsed as a substrate~ A mixture in which an ethylene/vinyl acetate copolymer ~15 mol% vinyl acetate) and rosin a~ a tackifier were incorporated in a ratio of 85:15 was extrusion coated in a -thickness of 20 ~m on the back of -the substrate. The so treated panel substrate was bonded -to a ca.rd by thermocompression at 120C. The card was free from any deterioration. There was no discolora-tion of the ink of which the printed graphic pattern was formed on the signature panel. In addition, the signature pane~ adhered to the card with sufficient strength.
To verify its effectiveness, the method of F.xample 2 ~. ' .' ~- :
: . . . - :
,C~ 3 3 ~
- ~2 -was compared with a prior art method of bonding signature pane:Ls to cards.
Comparative Exam~le 2 _____ An adhesive was prepared accordin~ to the following 5 formula:
Vinyl chloride acetate resin 15 par-ts Acrylic resin 10 parts Methyl ethyl ketone 38 partæ
Toluene 37 parts The adhesive was coated onto a signature panel of American Banlcno-te Co., Ltd. as in Example 2. The ink used to print the graphic pattern on the signa-ture panel dissolved into the solvents in the adhesive and discoloration of the graphic pattern occurred.
5 Example 3 An adipate ester based linear polyurethane resin ~Paraprene P22S of Nippon Miractron Co., Ltd.) was dissolved in a solvent system of dimethylformamide and methyl ethyl ketone to give a solids content of 15%, whereby a polyurethane coating solu-tion was prepared. This solution was roll coated in a thickness of 5 ~m onto silicone release paper and the solvents were evaporated by drying. In a separate step, an ink was formulated as in Example 1 and a graphic pattern was printed on a signature panel substrate that was made of wood-~ree paper. The silicone release paper was then bonded to the signature panel substrate by means of heated rolls at 110Co Subsequently, -the silicone release paper was stripped and the assembly of the substrate and the polyurethane coa-t was slit to tapes in a width of 10 mm, whereby signature panels were produced.
Those signature panels were bonded onto cards by thermocompression at 110C. The thus prepared cards were *Trade-mark 2 ~ 3 ~
free from any deterioration. Discoloration of -the ink oE
which the printed ~raphic pattern was forme~ on the signature panels did not occur. ln addition, -the signature panels adhered so strongly to the cards tha-t they could no-t be stripped without picking of the paper base. lt was therefore clear that those signature panels had satisfactory securi-ty against forgery and ta~pering.
As described on the foregoing pages, the signature panel of the present inven-tion has a thermoplastic resin layer formed on the back side which is opposite the writing surface carrying a printed graphic pattern that is highly permeahle to alcohols, organic solvents, bleaahing agents and surfac~ants and that ~ill change upon exposure to those chemicals. ~ecause of this structure, the signature panel has high security against the forgery and tampering. This signature panel can be bonded to card substrates without using adhesives containing solvents and, hence, withou-t causing any change in the printed graphic pat~ern on the panel. Furthermore, oversheet substrates which have graphic patterns formed in correspondence to overprint cards can be used with the signature panel of the present invention without experiencing any thermal deforma-tion~ In addition, the thermoplastic resins that are used in the present invention will exhibi-t very good bonding properties when they are thermocompressed onto vinyl chloride resin sheets, PET sheets, metal sheets, glass sheets and other card substrates.
According to the process of the present invention for producing the above-described signature panel, the thermoplastic resin can be coa-ted onto the back of a signature panel substrate in such a way that the panel can be bonded to card substrates without reducing the strength of adhesion. As a further advantage, the ther~oplastic resin can be applied to form such a thin layer that it will not spread beyond the edges of the panel, -thereby . . ~ . .
. . .
.
2 ~ 3 5 - 14 ~
permitting -the panel to be nea-tly positioned on the card substrate.
:Lf necessary the -thermoplastic resin may be applied using organic solvents and o-ther coating aids and yet -the prin-ted graphic pa-t-tern on the signature panel will no-t be affected adversely.
:
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Claims (10)
1. A signature panel that has a thermoplastic resin layer provided on the side opposite the writing surface carrying a printed graphic pattern that will change upon exposure to alcohols, organic solvents, bleaching agents and surfactants.
2. A signature panel according to claim 1 wherein said thermoplastic resin layer formed on the back of the panel has a thickness of 2 - 50 µm.
3. A signature panel according to claim 1 wherein said thermoplastic resin Is selected from the group consisting of urethane resins, vinyl chloride polymers, mixtures and copolymers thereof.
4. A signature panel according to claim 3 wherein said urethane resin is a linear random alternating block copolymer that contains a hydroxyl terminated long-chain polyol diisocyanate having a molecular weight of 1,000 to 3,000 and a chain extender as a main component.
5. A signature panel according to claim 3 wherein said urethane resin is such that the chemical equivalent ratio of an isocyanate group to a hydroxyl group is less than unity.
6. A signature panel according to claim 3 wherein said thermoplastic resin contains vinyl chloride in an amount of 20 - 80 wt%.
7. A signature panel according to claim 1 wherein said thermoplastic resin is selected from the group consisting of ethylene/vinyl acetate copolymers, ethylene/acrylic acid copolymers, ethylene/acrylic acid ester copolymers, mixtures thereof with a tackifier, and mixtures thereof with a tackifier and a wax.
8. A signature panel according to claim 1 wherein said panel substrate is made of a material that is highly permeable to alcohols, organic solvents, bleaching agents and surfactants.
9. A process for producing a signature panel that, comprises the steps of forming on the writing surface of a panel substrate a printed graphic pattern that will change upon exposure to alcohols, organic solvents, bleaching agents and surfactants, and laminating the other surface of the panel substrate with thermoplastic resin by extrusion or hot melt coating.
10. A process for producing a signature panel that comprises the steps of forming on the writing surface of a panel substrate a printed graphic pattern that will change upon exposure to alcohols, organic solvents, bleaching agents and surfactants, roll coating release paper with a thermoplastic resin dissolved in an organic solvent, removing the solvent by drying, and laminating the other surface of the panel substrate with the thermoplastic resin layer by thermal fusion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2249756A JPH0780346B2 (en) | 1990-09-19 | 1990-09-19 | Sign panel and method of manufacturing sign panel |
| JP249756/1990 | 1990-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2051535A1 true CA2051535A1 (en) | 1992-03-20 |
Family
ID=17197761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002051535A Abandoned CA2051535A1 (en) | 1990-09-19 | 1991-09-17 | Signature panel and process for producing the same |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5215809A (en) |
| EP (1) | EP0476636B1 (en) |
| JP (1) | JPH0780346B2 (en) |
| AT (1) | ATE124339T1 (en) |
| AU (1) | AU656148B2 (en) |
| CA (1) | CA2051535A1 (en) |
| DE (1) | DE69110811T2 (en) |
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| US5438928A (en) * | 1990-01-31 | 1995-08-08 | Thomas De La Rue & Company Limited | Signature panels |
| JPH05508120A (en) * | 1990-07-12 | 1993-11-18 | ドゥ ラ リュ インターナショナル リミティド | Improvements regarding the sign panel |
| GB9106128D0 (en) * | 1991-03-22 | 1991-05-08 | Amblehurst Ltd | Article |
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| US6326082B1 (en) | 1999-03-11 | 2001-12-04 | Agfa-Gevaert | Security document comprising a mixture of polyurethanes |
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| ATE391151T1 (en) * | 2002-10-09 | 2008-04-15 | Exxonmobil Chem Patents Inc | HEAT SEALABLE RESIN COMPOSITIONS AND USE THEREOF |
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| US10103632B2 (en) | 2011-04-18 | 2018-10-16 | Richtek Technology Corp. | Enhanced phase control circuit and method for a multiphase power converter |
| TWI408881B (en) * | 2011-04-18 | 2013-09-11 | Richtek Technology Corp | Enhanced phase control circuit and method for a multiphase power converter |
| CN111746012B (en) * | 2020-06-04 | 2022-04-12 | 福建夜光达科技股份有限公司 | Preparation method of light-reflecting back adhesive film |
| CN114434932B (en) * | 2022-03-08 | 2022-09-09 | 苍南百体实业有限公司 | Anti-cracking PET card and preparation process thereof |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1216920A (en) * | 1956-10-02 | 1960-04-29 | Addressograph Multigraph | Printing device |
| DE1646225C3 (en) * | 1967-01-12 | 1975-08-28 | Addressograph-Multigraph Corp., Cleveland, Ohio (V.St.A.) | Identity document and process for its production |
| DE2100682B2 (en) * | 1971-01-08 | 1973-03-29 | Adrema Pitney-Bowes Gmbh, 6148 Heppenheim | FALSE-PROOF IDENTIFICATION CARD |
| FR2129198A5 (en) * | 1971-05-18 | 1972-10-27 | Cit Alcatel | Composite plastic signs - mfd as blank sheets incorporating latent photo-sensitive tamperproof colourants |
| US4092449A (en) * | 1974-10-07 | 1978-05-30 | Bernstein Donald J | Alteration-sensitive imprinted article |
| US4051295A (en) * | 1974-12-20 | 1977-09-27 | Bernstein Donald J | Alteration-sensitive surface |
| GB1507288A (en) * | 1975-07-11 | 1978-04-12 | Fuji Photo Film Co Ltd | Laminated card |
| JPS5365799A (en) * | 1976-11-24 | 1978-06-12 | Dainippon Printing Co Ltd | Magnetic card |
| DE2801015C2 (en) * | 1978-01-11 | 1983-01-13 | Jöllenbeck & Kasten Gesellschaft für Geschäftsdrucksysteme mbH, 4690 Herne | Identity card, e.g. check card |
| GB8400746D0 (en) * | 1984-01-12 | 1984-02-15 | Bradbury Wilkinson Cheques Ltd | Security document |
| FR2570101B1 (en) * | 1984-09-07 | 1987-09-25 | Sotimag | ANTI-FRAUD PROCESS FOR VALUE DOCUMENTS |
| DE3440653A1 (en) * | 1984-11-07 | 1985-03-28 | Günter H. Dr.-Ing. 8035 Gauting Marx | Method for making visible attempts to tamper with embossed plastic cards |
| DE3665506D1 (en) * | 1986-07-04 | 1989-10-12 | Agfa Gevaert Nv | Dye image receiving material |
-
1990
- 1990-09-19 JP JP2249756A patent/JPH0780346B2/en not_active Expired - Lifetime
-
1991
- 1991-09-17 AU AU84544/91A patent/AU656148B2/en not_active Ceased
- 1991-09-17 CA CA002051535A patent/CA2051535A1/en not_active Abandoned
- 1991-09-18 DE DE69110811T patent/DE69110811T2/en not_active Expired - Fee Related
- 1991-09-18 AT AT91115881T patent/ATE124339T1/en not_active IP Right Cessation
- 1991-09-18 EP EP91115881A patent/EP0476636B1/en not_active Expired - Lifetime
- 1991-09-18 US US07/761,563 patent/US5215809A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| AU8454491A (en) | 1992-03-26 |
| EP0476636A1 (en) | 1992-03-25 |
| EP0476636B1 (en) | 1995-06-28 |
| US5215809A (en) | 1993-06-01 |
| DE69110811T2 (en) | 1995-12-07 |
| AU656148B2 (en) | 1995-01-27 |
| DE69110811D1 (en) | 1995-08-03 |
| ATE124339T1 (en) | 1995-07-15 |
| JPH0780346B2 (en) | 1995-08-30 |
| JPH04128086A (en) | 1992-04-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |